24 April 2019
University of New South Wales, Australia
University of Milan, Italy
Furtwangen University, Germany
University of Technology, Australia
United Arab Emirates University, UAE
University of Fribourg, Switzerland
University of Milan, Italy
University of New South Wales, Australia
University of Technology, Australia
EBTIC, Abu Dhabi, UAE
Università degli Studi di Milano, Italy
University of Saskatchewan, Canada
Graz University of Technology, Austria
Fudan University, China
SAP Co-Innovation Lab, USA
Edith Cowan University, Australia
Schneider Electric, Germany
IFIP IES, TIE, TII
KAIST, Korea
Ex. President IEEE-IES
Fraunhofer FIT, Germany
IEEE IES AdCOM
EBTIC, UAE
University of Milan and Khalifa University of Science and Technology (KUST), UAE
United Arab Emirates University, U.A.E
AT&T Inc, iFOSSF USA
University of New South Wales, Australia
Universita' degli Studi di Milano
HP Labs (HP Inc.)
Technische Universitat Wien
Haldia Institute of Technology
Universite de Lyon
Fachhochschule Worms
Taiger, Spain
University of Bordeaux
University of Brighton
University of Castilla-La Mancha
University of Castilla-La Mancha
City University of London
Masdar Institute of Technology
sonyamath@ieee.org